Relife RL-044 Android CPU Tinned BGA Reballing Stencil Set
Ready stock
₹3,429.86
As low as ₹ 3134.89
₹3,320.10
-3%
3 Piece
₹3,241.21
-6%
5 Piece
₹3,134.89
-9%
10 Piece+
Wholesale Discount
Bulk order only
ID : Relife RL-044 Android CPU Tinned BGA Reballing Stencil Set
Weight : 0.45 kg
Relife RL-044 Android CPU Tinned BGA Reballing Stencil Set for Qualcomm / MTK / Hisilicon
Product details
- Precise alignment/Fast and convenient/High-temperature resistance/No deformation
- The real machine is measured to ensure accuracy, and each stencil is checked according to the original factory drawings to ensure that every solder joint cannot be missing
- It is specially designed and used for mobile phone chips. The round and square precise hole positions make the solder balls more rounded and meet the tin planting requirements for various chips
- Ultra-thin design, better fit of tin planting, continuous bending, and full toughness
- Suitable for Qualcomm Snapdragon 888/SM8350/845/SMD845/765G/SM7250/855/SM8150/865 Large/SM8250-002/865 Small/SM8250/8Gen1/SM8450/888/SM8350 Anti-Short Circuit Isolation/780/775/SM7350/ 778G/SM7325
- High-quality special steel is selected, which has good high-temperature resistance and metal fatigue resistance so that each tin point is heated evenly
- The round and square precise hole position makes the solder balls more rounded and prevents the mesh holes from jamming the solder balls
Additional Information
| SKU | Relife RL-044 Android CPU Tinned BGA Reballing Stencil Set |
|---|---|
| Weight | 0.450000 |
Customer Reviews
0.0
/ 5.0
☆
☆
☆
☆
☆
5
4
3
2
1