2uul PH11 HOT-BLOCK Preheater for Mobile Phone
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2uul PH11 HOT-BLOCK Preheater for Mobile Phone Motherboard PCB Delamination Rebonding
Product details
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High-quality 2UUL PH11 HOT-BLOCK preheater designed for professional motherboard repair
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Specially used for PCB delamination rebonding and layered board separation
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Provides even and controlled heat to avoid overheating sensitive components
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Helps loosen glue and solder layers before CPU, baseband, or IC rework
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Improves bonding strength during rebonding and re-lamination process
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Compatible with most smartphone motherboards (iPhone & Android)
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Compact, durable design suitable for repair shops and labs
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Enhances repair efficiency and reduces failure rate
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Must-have equipment for chip-level mobile repairing.
Additional Information
| SKU | 2uul PH11 HOT |
|---|---|
| Weight | 0.750000 |
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