The 2UUL DA28 FlatCut Solder Pad Underfill Glue Removal Blades are specially designed for professional mobile phone and electronics repair. Engineered for precision, these ultra-thin and sharp blades effortlessly remove underfill glue from IC chips, solder pads, and tight PCB areas without damaging components.

Made from durable high-quality stainless steel, this 5-piece blade set offers excellent resistance to bending and wear. Whether you're handling tough glue or delicate solder pads, the FlatCut profile ensures clean and controlled removal—ideal for technicians working on smartphones, tablets, or PCBs.

Each blade fits standard handles and is packaged in a safe, compact box for secure storage and easy portability. A must-have tool for professionals in chip-level repair and logic board refurbishment.