Premium Quality Build: Made of high-strength metal with precision CNC machining for durability and stability during reballing.

Dual-Sided Design: Features two magnetic working sides — one for positioning NAND chips and another for small ICs, increasing efficiency.

Strong Magnetic Base: Ensures steady chip placement, preventing movement during soldering or heating.

Wide Compatibility: Suitable for iPhone, iPad, and Android NAND/CPU reballing and chip repair.

Professional Use: Ideal for advanced technicians, mobile repair labs, and BGA rework professionals.

Heat Resistant: Designed to withstand high reflow temperatures during hot air or rework station use.

Precision Engineering: Offers smooth operation and accurate alignment for clean solder ball placement.

Portable & Convenient: Compact size makes it easy to carry and store in any repair workstation.