2uul BH11 Universal Moblie Phone Middle Layer Frame
Ready stock
₹901.62
As low as ₹ 823.17
₹882.68
-2%
3 Piece
₹855.63
-5%
5 Piece
₹823.17
-9%
10 Piece+
Wholesale Discount
Bulk order only
ID : 2uul BH11 Universal Moblie Phone Middle Layer Frame
Weight : 0.35 kg
2uul BH11 Universal Moblie Phone Middle Layer Frame BGA Reballing Magnetic Platform
Product details
1.The magnetic platform can adsorb and fix each planting tin steel stencil.
2. The platform groove has two depths (1mm and 2mm) for different thicknesses of mobile phone motherboards/chips
3.The platform is high-temperature resistant The heat gun can be operated directly from the platform.
Additional Information
| SKU | 2uul BH11 Universal Moblie Phone Middle Layer Frame |
|---|---|
| Weight | 0.350000 |
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