1. Universal 2UUL BG02 reballing stencil designed for precise BGA chip reballing.

2. High-precision stainless steel stencil for accurate solder ball placement.

3. Professional reballing stencil suitable for multiple IC and chipset repairs.

4. Durable heat-resistant stencil ideal for mobile phone motherboard repair.

5. Universal BGA reballing tool for technicians and repair shops.

6. Fine hole design ensures uniform solder ball distribution during reballing.

7. Easy-to-use reballing stencil for fast and clean IC repair work.

8. Strong and reusable stencil built for long-term professional use.

9. Essential reballing accessory for CPU, IC, and chipset maintenance.

10. 2pcs per pack universal stencil for reliable BGA reballing repairs.